Bangalore: British electronics assembly materials firm Cookson Electronics today (Oct 4, 2004) said it has set-up its India research centre in Bangalore and plans a manufacturing-scale surface mount technology (SMT) assembly line for electronics assembly and semiconductor device packaging in a year.

The research centre, established at the Indian Institute of Science (IISc) campus will work on emerging areas like nanotechnology and functional polymers.

"In the first phase, we will invest $three million to $five million in the research centre and in the second, about $two million to $five million. The SMT line would be functional within six to 12 months," Cookson Electronics Assembly Materials President David B Zerfoss told reporters.

He said India emerged as a choice for the centre among other places like China, Japan and Singapore for its English speaking talent.

Cookson Vice President and Chief Technology Officer Bawa Singh said the manufacturing unit would be primarily used for applying the technology developed by researchers in Bangalore and would not be used for commercial manufacturing. Cookson has a manufacturing presence in Chennai serving customers like Flextronics, Centum Solectron and plans for Elcoteq and aims revenues of $30 million this fiscal.

About 15 researchers will work initially in the centre, which would be ramped up further based on requirements, Cookson India Managing Director Raji Koshy said.